Semiconductor Packaging cleaning

To ensure the high reliability, stability, and service life of semiconductor devices, improve the yield of semiconductor products, and avoid circuit failure caused by pollution, it is necessary to clean semiconductors, including semiconductor chip cleaning, WBC cleaning, power module, power device, power electronics, discrete devices, BGA ball planting cleaning, chip silver paste printing residue cleaning, power LED flip chip, PoP stacked assembly chip The residual auxiliary materials after semiconductor packaging and welding of system-in-packaging chips, DCB, COB, and IGBT power modules include flux, solder paste, ball solder paste, solder paste residue, metal pollutants (particle contamination, alkaline metals, heavy metals, etc.), and organic dirt for cleaning.