Exploration of New Water-based Cleaning Agents for Electronic Assembly Parts

PCBA is a core component in electronic instruments, computers, postal communication, automation control, and electronic equipment. The quality and reliability of its assembled and powered use are closely related to the cleanliness of PCBA. If the PCB is not cleaned or not thoroughly cleaned after welding, the residual solder on the board surface will have an impact on the performance of the circuit board and components for a long time, which will reduce its surface insulation resistance. Especially in high temperature and high humidity environments, serious corrosion and leakage will occur, affecting the reliability of the entire machine. Welding dirt has a great destructive effect on printed circuit boards, causing changes in the signal of the circuit, resulting in problems such as electromigration, corrosion, and decreased adhesion of the coating layer. In severe cases, it can cause circuit board failure.

Due to the importance of cleaning PCBA circuit boards, their cleaning has become an essential part. With the trend of miniaturization of electronic assemblies, finer and lower gaps between assemblies require smaller particle metal solder and more flux activators. The above changes have significantly increased the difficulty of cleaning electronic assembly parts. How to achieve good cleaning results in the current trend of electronic assembly parts is a question worth considering for the electronic cleaning industry and electronic cleaning users. Let's explore the development direction of new water-based cleaning agents together.

Cleaning is the process of using physical and chemical reactions to remove pollutants and impurities from the surface of the washed object. Regardless of whether solvent cleaning or water cleaning is used, it must go through surface wetting, dissolution, emulsification, saponification, and other processes. Different mechanical forces are applied to remove pollutants from the contaminated surface, followed by rinsing or rinsing, and finally blowing, drying, or natural drying.

Due to the importance of cleaning PCBA circuit boards, their cleaning has become an essential part. With the trend of miniaturization of electronic assemblies, finer and lower gaps between assemblies require smaller particle metal solder and more flux activators. The above changes have significantly increased the difficulty of cleaning electronic assembly parts. How to achieve good cleaning results in the current trend of electronic assembly parts is a question worth considering for the electronic cleaning industry and electronic cleaning users. Let's explore the development direction of new water-based cleaning agents together.

Cleaning is the process of using physical and chemical reactions to remove pollutants and impurities from the surface of the washed object. Regardless of whether solvent cleaning or water cleaning is used, it must go through surface wetting, dissolution, emulsification, saponification, and other processes. Different mechanical forces are applied to remove pollutants from the contaminated surface, followed by rinsing or rinsing, and finally blowing, drying, or natural drying.

The primary task in developing new water-based cleaning agents is to understand the types of dirt, such as changes in the type of flux upgraded to adapt to miniaturization in electronic assembly. The new cleaning agent must be effectively added to remove the components of the flux, in order to achieve a rapid cleaning effect of flux residue. Therefore, the development of new water-based cleaning agents must closely follow the changes in soldering flux, with the latest solder paste, flux, and glue as the research and development benchmark.

Secondly, with the miniaturization of electronic assembly components, products become high-density and high-precision. In electronic assembly components with low spacing and clearance, lower surface tension is required to enter, wet, and clean the surface with low spacing and clearance. Therefore, new water-based cleaning agents should choose surfactants with low surface tension as much as possible to obtain water-based cleaning agents with stronger permeability, so that the cleaning agent can enter very small gaps to complete cleaning.

Once again, with the precision of electronic assembly components, there is concern that ultrasound may cause damage to precision components. New water-based cleaning processes mostly use spray cleaning technology, which has more spray pipes and higher spray pressure than traditional spray pipes. Under these process conditions, higher requirements are placed on the foam suppression function of water-based cleaning agents. Therefore, new water-based cleaning agents should choose low foaming or non foaming surfactants as much as possible.

Finally, with the increasing complexity of electronic assembly functions, there are more and more electronic assembly components such as sensitive metals, bare chips, sensitive coatings, etc. Therefore, the new water-based cleaning agent needs to be familiar with the latest materials of electronic assembly parts in order to adapt to the material compatibility of the latest electronic assembly parts.

Unibright has been focusing on the development of water-based cleaning agents for 25 years, with a skilled R&D team, excellent high-end experimental equipment, and professional laboratories. We keep up with the latest changes in electronic components, including materials, dirt, and cleaning difficulties, and can excellently clean electronic components. Even for cleaning the latest solder paste and flux, Unibright provides you with solutions to help solve cleaning problems.