Halogen free no-clean flux 508 Introduction

The density and uniformity of the flux coating have a critical impact on its successful application.

When soldering flux is used in tin dipping operations, due to the natural volatilization of the flux in the open container, appropriate addition of Unibright's 2010 diluent is required to control the specific gravity and maintain its concentration within a certain range.

In non operating conditions, it is recommended to avoid contact between the flux and air as much as possible to shorten the service life of the flux. When suspended solids are found in the flux liquid, the flux inside the container should be promptly removed and replaced.